Molecular and Ionic Compound Structure and Properties unit test
A test on this unit alone, marked as a percentage and a letter grade — for the test your class is actually sitting, rather than for May. Answer everything, then submit once: seeing the answer to question 3 before attempting question 4 makes the final percentage meaningless.
Conductivity of ionic compounds
Network covalent solids
Hybridization
Lewis structures
Molecular geometries
Bond polarity vs molecular polarity
Metallic bonding
Alloys
Sigma vs pi bonds
VSEPR theory
Bond dipole
Covalent bonding
Short answer 1. Define or explain: Formal charge
3 ptsShort answer 2. Define or explain: Expanded octet
3 ptsShort answer 3. Define or explain: Why ionic solids are brittle
3 ptsShort answer 4. Define or explain: Coulombic reasoning for melting point
3 ptsFree response
4 ptsComplete Lewis diagrams and some physical properties for compounds X and Y are given. Compound X: a central carbon atom bonded to three CH3 groups and to an —OH group. That is, (CH3)3C—OH. Molar mass 74.1 g/mol, boiling point 82°C. Compound Y: a central SILICON atom bonded to three CH3 groups and to an —OH group. That is, (CH3)3Si—OH. Molar mass 90.2 g/mol, boiling point 98°C. The two structures are otherwise identical; only the central atom differs.
(a) Based on VSEPR theory, predict the geometry around the Si atom in compound Y.
(b) A student claims that compound Y has a higher boiling point than that of compound X because compound Y has stronger London dispersion forces. Do you agree or disagree? Justify your answer.
(c) An equimolar mixture of the two compounds is heated. When the mixture reaches 82°C, which compound will have the higher vapor pressure? Justify your answer.
(d) The mixture is heated to 198°C in a sealed, rigid 12.5 L container, at which point both substances are gases and the total pressure in the container is 2.30 atm. Calculate the number of moles of gas particles in the container.